Where is Microsemi Corporate office Headquarters
Microsemi Headquarters Address and Contact
Microsemi Headquarters Location & Directions
Microsemi Headquarters Executive Team
Name |
Title |
---|---|
James J. Peterson |
Chairman of the Board and Chief Executive Officer |
Paul Pickle |
President and Chief Operating Officer |
John W. Hohener |
Executive Vice President, Chief Financial Officer, Secretary and Treasurer |
Steven G. Litchfield |
Executive Vice President and Chief Strategy Officer |
Rick Goerner |
Executive Vice President of Marketing and Sales |
David Goren |
Senior Vice President Business Affairs, Legal and Compliance |
Robert C. Adams |
Senior Vice President of Corporate Development |
About Microsemi, History and Headquarters Information
The company was founded in the year 1959. The company has been currently active for more than 60 years now. The founders of this company are Arthur Feldon and Steve Manning. The company was initially started as MicroSemiconductor in the Culver City of California. On September 27, 1960, the company was incorporated in Delaware. The company renamed itself to Microsemi in 1983. In the year 1992, the company purchased Unitrode’s semiconductor products division. In early 2018, the company was acquired by Microchip Technology for an amount of around $10 billion. Headquarters: 8700 E Thomas Rd, Scottsdale, AZ 85251, USA.
Microsemi is an American company which mainly focuses on providing the best system and semiconductor solutions for data centre and industrial markets, aerospace and defence and also communications too. As of 2016, the company had around 4400 employees working under it. The company has James J. Peterson as its current CEO and Chairman. In the year 2016, the revenue generated by the company was around $1.655 million.
Microsemi provides its services on various types of semiconductor and system solutions which include power management products, precise time solutions, timing and synchronisation devices, radio frequency solutions, enterprise storage and communication solutions, voice processing devices, field programmable gate arrays, analog mixed-signal integrated circuits, system on chip solutions and application-specific integrated circuits, etcetera.